COMSOL Day: Electronic Devices

Multiphysics simulation is widely used by scientists and engineers for the design and development of electronic devices, as well as in the manufacturing and testing of these devices. It provides unrivaled capabilities for understanding and optimizing device designs to enhance performance and reliability. Multiphysics simulation is also used to improve the resilience of electronic packaging against unwanted mechanical, thermal, and electromagnetic effects.

The COMSOL Multiphysics^® simulation platform and its add-on products provide a unique environment where a wide range of physics phenomena — including low-frequency and high-frequency electromagnetism, charge-carrier transport, heat transfer, and structural mechanics — can not only be modeled but also coupled and combined.

The benefits of using COMSOL Multiphysics^® to model electronic devices can be extended to larger groups of colleagues (with or without simulation expertise) by using the software to create and share standalone simulation apps.

In this introductory session, we will discuss the use of multiphysics simulation for the development of electronic devices. We will also provide a brief overview of the topics that will be covered during this COMSOL Day.

In the electronics industry, the use of modeling and simulation has become a valuable asset for design and development, enabling accurate virtual prototyping that provides insight into the processes underlying electronic devices and helps produce increasingly efficient products.

The COMSOL Multiphysics^® software is widely used in the design and integration of passive devices and sensors, contributing to the improvement of their robustness and performance. For use in this area, the AC/DC Module, an add-on product, offers extensive functionality for modeling electrical circuits and lumped systems, as well as three-dimensional electromagnetic fields. The software's unique capabilities also extend to combining a broad range of physics phenomena and their interactions in a single simulation, enabling the modeling of complex electromechanical components.

In this session, we will demonstrate the capabilities of COMSOL Multiphysics^® for modeling capacitive, inductive, and resistive devices. We will also highlight some built-in multiphysics couplings through different examples, such as capacitive pressure sensors and accelerometers.

Modeling and simulation has been used for understanding, designing, and refining optoelectronic and semiconductor devices, allowing systems governed by drift-diffusion and quantum confinement phenomena to be studied in detail.

The Semiconductor Module, an add-on to the COMSOL Multiphysics^® software, is used to model systems such as metal–oxide–semiconductor field-effect transistors (MOSFETs), solar cells, photodiodes, and LEDs and offers functionality for modeling the interplay between drift-diffusion, electromagnetic wave propagation, and thermal effects in semiconductors. This unique multiphysics capability enables self-consistent simulation of optoelectronic devices. In addition, by being customizable, it enables the analysis of novel semiconductor designs, including organic semiconductor devices.

This session will provide you with an overview of the semiconductor physics and multiphysics modeling capabilities of COMSOL Multiphysics^® and will demonstrate the software's modeling workflow to study optoelectronic and semiconductor devices.

Learn the fundamental workflow of COMSOL Multiphysics^®. This introductory demonstration will show you all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and evaluating and visualizing results.

The use of modeling and simulation in the electronics industry is highly effective for designing efficient thermal management solutions, allowing users to virtually test different operating conditions and gain valuable insights that would otherwise be too difficult, expensive, and time-consuming to achieve with physical experiments and prototypes.

The COMSOL Multiphysics^® software and its add-on modules offer a wide range of features to model heat transfer by conduction, convection and radiation, as well as electromagnetic modeling functionalities. The software's built-in multiphysics capabilities allow engineers to create high-fidelity simulation models that account for electromagnetic and thermal interactions to test the efficiency of different component designs and cooling technologies.

In this session, we will demonstrate how to build models and simulation applications using COMSOL Multiphysics^® and highlight some heat transfer modeling features using examples relevant to the thermal management of electronic components. We will also provide an overview of the platform’s capabilities for multiphysics modeling, with a focus on couplings involving heat transfer phenomena.

As electronic components become increasingly complex and miniaturized, the use of modeling and simulation has become invaluable for designing, testing, and optimizing electronics packaging to withstand mechanical, thermal, and electromagnetic failures. Using simulation, engineers can accelerate the development process, reduce costs, and improve the overall performance of the end product.

The COMSOL Multiphysics^® software and its add-on products provide a wide range of functionalities to model the real-world behavior of electronic devices and virtually test their integrity under various operating conditions. The platform's unique multiphysics capabilities enable users to investigate thermal stresses, fatigue, nonlinear behavior, electromagnetic interference, and electrostatic discharges, all within a single modeling environment.

In this session, we will demonstrate how to build physics-based models using COMSOL Multiphysics^®. We will highlight important modeling features and multiphysics capabilities through examples related to the packaging and testing of electronic devices.