Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

How can i model intermetallic phase formation during soldering ...

Please login with a confirmed email address before reporting spam

Hallo,
Can anybody please give me the idea how to model intermetallic phase formation during heating and solidification of solder material (Sn) and Subtract (Cu). During soldering Sn (soldering material) reacts with Cu subtract and form Cu6Sn5 & Cu3Sn in different temperature (for example from 25 degree to 260 degree, keep the temperature constant at 260 for 15 minutes and solidify from 260 to 25 degree).

I will be grateful if anybody can give me an idea. I'm attaching here the geometry with dimension.

Thanks,
Chaki


0 Replies Last Post 20 gen 2016, 09:16 GMT-5
COMSOL Moderator

Hello Chironjeet Chaki

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.