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Issues about settlement of condition-The temperature change input of an isothermal body
Posted 25 feb 2022, 11:18 GMT-5 Heat Transfer Version 5.6 2 Replies
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Hello. My simulation is for a packaged electronic component (3D), the main structure of which is the chip, the pin and the package structure. I would like to simulate** the temperature of the package structure and the pins as a function of the chip temperature**. The chip is assumed to be isothermal. The problem encountered is that the chip is a 3D isothermal body and it is not possible to impose changing temperature conditions through the temperature boundary (face boundary). Here I would like to inquire on setting up the multi-physics field conditions.
looking forward to replys.