Preconditioning (PRE) of Surface-Mount Devices (SMDs) for Testing

Application ID: 120921


Prior to the reliability testing, surface-mount devices (SMDs) are required to go through a preconditioning process, which represents the effects of storage and the typical reflow operation in the following board assembly process. During the preconditioning process, test samples usually are subjected to temperature cycling, dry bake, moisture soaking, and solder flow operations. This model analyzes the stress of the SMD caused by the change of temperature and humidity to evaluate the structure deformation and damage of the SMD.

The test method is based on the Standard JESD22-A113I (https://www.jedec.org/node/8493)

This model example illustrates applications of this type that would nominally be built using the following products: