Preconditioning (PRE) of Surface-Mount Devices (SMDs) for Testing
Application ID: 120921
Prior to the reliability testing, surface-mount devices (SMDs) are required to go through a preconditioning process, which represents the effects of storage and the typical reflow operation in the following board assembly process. During the preconditioning process, test samples usually are subjected to temperature cycling, dry bake, moisture soaking, and solder flow operations. This model analyzes the stress of the SMD caused by the change of temperature and humidity to evaluate the structure deformation and damage of the SMD.
The test method is based on the Standard JESD22-A113I (https://www.jedec.org/node/8493)
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- CAD Import Module and
- either the MEMS Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Tabella delle Funzionalità and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.