La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model is of the P.57 Type 4.3 Full-band Ear Simulator. The model includes the geometry of the ear canal as well as the pinna defined in the ITU-T P.57 standard. The model also includes interpolation data for an ear drum impedance ensuring correct acoustic properties of the ear. The ... Per saperne di più
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. Per saperne di più
A tweeter is a high frequency driver used in loudspeaker systems. An ideal tweeter will produce a constant sound pressure level at a given distance in front of the driver independently of frequency, that is, a flat response. Ideally the tweeter will also, to a certain degree, maintain ... Per saperne di più
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Per saperne di più
This example demonstrates how to use a background field in a sound scattering problem. The application is an acoustic invisibility cloak made of a metamaterial. Two different types of metamaterials are used, one using an anisotropic acoustic material with varying properties and one using ... Per saperne di più
This tutorial application demonstrates the modeling of a hinge joint between two bodies in COMSOL Multiphysics. Various nodes available for joints such as Constraints, Locking, Spring, Damper, Prescribed Motion, and Friction are also demonstrated. Many real structures can be ... Per saperne di più
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... Per saperne di più
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Per saperne di più
The magnets in an Interior Permanent Magnet (IPM) motor are embedded in the rotor core, where they form narrow regions known as bridges. The thickness of the magnetic bridge is an important parameter to consider in design, both from the electromagnetic and the mechanical perspectives. As ... Per saperne di più
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... Per saperne di più