Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.
Meshing a big thin volume (~2.5 mm x 6.5 mm x 14 um)
Posted 30 set 2016, 11:28 GMT-4 Low-Frequency Electromagnetics, Mesh Version 5.2a 0 Replies
Please login with a confirmed email address before reporting spam
I have being simulating the capacitance between different pads/terminals between CMOS chips assemblies for the last year without a problem.
Usually, these pads are 20 x 20 x 4 um and the chips assembly is ~15 um (small volume).
Now I am trying to simulate a test structure that has about the same thickness (14um) but the pads are 1.5 x 1.5 mm large.
The structure that I am trying to simulate is 2.5 mm x 6.5 mm x 14 um (its thickness is much smaller than its area) and (I think) this is making the meshing more complicated to do (even more as it is composed by different layers, going from 0.2 um to 5 um).
I have already tried to use (in just one of the simplest domains) Free Tetrahedral meshing and Free tetrahedral/quad + Sweep (controlling the distribution and trying different edges) on the boundaries.
I don't know how to proceed and that's why I am here. I would like to ask for help from this community (as I already did it before and it was super fruitful). The model is attached.
Many thanks for any help!
Cheers,
Mateus
Attachments:
Hello Mateus Vicente
Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.
If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.