Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.
Creating a via array easily
Posted 22 ott 2020, 05:34 GMT-4 General, Heat Transfer & Phase Change, Geometry Version 5.5 0 Replies
Please login with a confirmed email address before reporting spam
Hi,
I want to create a square via array which will be 3x3 mm². Each via cell is composed by a via with 0.1mm of diameter, 0.025mm of copper thickness for the barrel, and a spacing between the vias of 0.125mm. The board is composed by 2 copper layers (bottom and top) with 18um of thickness and a inner FR4 layer of 1mm - 36um.
This array would be composed by 144 vias (12x12) so it'd painful to fill this by hand. So I would like to ask some guidance to how to model this quickly in COMSOL. Even further I'd also like to ask if there is a way to parametrize the material used for the via filling. So usually speaking we would have solder, but we can imagine air and copper filled vias as well and I'd like to see the impact of that as well.
Here you have attached a very simplistic model (without the vias at all).
I excuse myself for the beginner question and thank you in advance for any answer received
EDIT:
I was able to solve the geometry using arrays, differences and so on. Now my big question mark on how to set the boundaries without having to select all them (i.e select the whole top of the board including vias, barrels and copper layer). This is to set temperatures and heat flows (and isolation)
Attachments:
Hello Guilherme Theis
Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.
If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.