La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Per saperne di più
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... Per saperne di più
Drying of porous media is an important process in the food and paper industry among others. Many physical effects must be considered: fluid flow, heat transfer with phase change, and transport of participating liquids and gases. All of these effects are strongly coupled, and predefined ... Per saperne di più
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Per saperne di più
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Per saperne di più
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Per saperne di più
This model demonstrates how to define Earth properties that are spatially varying on the planet. A satellite in orbit experiences solar, albedo, and planetary infrared (IR) loads, where albedo and planetary IR can vary with latitude and longitude. In this example, these inputs are read ... Per saperne di più
Fluid dampers are used in military devices for shock isolation and in civil structures for suppressing earthquake-induced shaking and wind-induced vibrations, among many other applications. Fluid dampers work by dissipating the mechanical energy into heat. This model shows the phenomenon ... Per saperne di più
This model demonstrates how to compute satellite temperature over multiple orbit periods by coupling Orbital Thermal Loads to Heat Transfer in Solids. The direct solar, albedo, and Earth infrared thermal loads are computed over a single orbit, and are periodically repeated over multiple ... Per saperne di più
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin Layer boundary condition with the thermally thick option is used to avoid ... Per saperne di più
