La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
Periodic microstructures are frequently found in composite materials, metallic foams, and sandwich structures. They can be described by a unit cell repeated along the three Cartesian directions. This app computes homogenized material properties of various periodic microstructures and ... Per saperne di più
A hinge between two mechanical components is modeled by coupling two rigid connectors. This method can be used for simulating many types of mechanisms. In mechanical assemblies, parts are sometimes connected so that they are free to move relative to each other in one or more degrees of ... Per saperne di più
This model studies the natural frequencies of a pre-tensioned string using the 2D Wire interface. This is an example of “stress stiffening”; in fact the transverse stiffness of wire elements is directly proportional to the tensile force. Strings made of piano wire have an extremely high ... Per saperne di più
Interference fit is a technique used to join or fit one part over or around another part. The internal part is cooled, so that it shrinks, and is then fitted. Once the part heats up again and expands, a contact pressure builds up at the interface between the two parts. This type of ... Per saperne di più
This tutorial shows how to evaluate the harmonic response of a structure with a moderately nonlinear behavior. A nonlinear problem can only be solved using time-domain analysis. A way to speed up the computation is to use a linearized frequency response analysis to provide good initial ... Per saperne di più
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
This example demonstrates the use of the Solid-Beam Connection multiphysics coupling to create transitions between the Solid Mechanics and Beam interfaces. Two different connection types are discussed, and a comparison of the stress distributions at the transition is made. Per saperne di più
This model illustrates how to perform prestressed eigenfrequency and frequency response analyses in a contact problem. A circular plate is squeezed between two thicker plates. The peak of the prestressed frequency response analysis is compared with the prestressed eigenfrequencies as ... Per saperne di più
This model describes a static stress analysis to obtain the stress distribution in the vicinity of a small hole in an infinite plate. The model is a classic benchmark and is described in Mechanics of Material, by D. Roylance. The stress level is then compared with the theoretical values. Per saperne di più
A steel ball is pressed down against a rubber membrane. When the contact pressure exceeds a certain value, the two parts start sticking together. When the ball is retracted, the membrane is pulled upwards in the bonded region. During the retraction, the bond is partially broken. This ... Per saperne di più