Presentazioni e Articoli Tecnici

Electroplating is a vital technology widely employed for many technological applications ranging from decorative or anti-corrosion coatings to high precision nanotechnology passive electromagnetic cloaking devices.

This 2D Axisymmetric Electroplating Model demonstrates one of the modeling methodologies that can be used to calculate the transient generation of a coating thickness of a deposited metal layer on the cathode electrode well in a copper-electroplating bath. The model computes the mass transport and deposition on the electrode of copper ions through the fluid medium, thus resulting in the transient calculation of the electrodeposition (electroplating) of a new copper layer.