Presentazioni e Articoli Tecnici

This paper deals with an integrated numerical and experimental analysis work aiming at the investigation of the thermal stress on nanowires in electronic gadgets especially computers and mobile phones. The comparative study of the nanowires are analyzed through the Thermal Stress physics using different variants such as Cu, Al, ZnO, Si(c), SiO2 which can be used in sensors, solar cells, LCD, batteries. The main goal of the research is to find effect of nanowire dimensions related to thermal stress developed by the gadgets. During the experimental measurements, three different combinations of materials are used to design a nano probe that can indicate the temperature increase on the surface of gadgets. In this study, the deformation in the nanowires due to thermal variations produced by the gadgets is simulated using COMSOL Multiphysics®.