Presentazioni e Articoli Tecnici

In this work, time dependent thermal analyses, performed on the 3D FE model of a multilevel Lab on Chip (LOC) platform are executed in order to gain insight into the temperature distribution within the device. By means of the COMSOL Multiphysics CAD import module, an extremely close 3D reproduction of the actual device, allowing to probe temperatures in those regions where an experimental measurement appears difficult or even impossible, is obtained. Different microfluidic chip materials (silicon/Pyrex®, polycarbonate, polymethylmethacrylate and cyclo-olefin copolymer) are virtually tested. Furthermore the close connection between the FE model and the actual device provides an immediate outcome on its fabrication steps.