Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.
Visualizza gli articoli presentati alla COMSOL Conference 2020
Efficient mixing and pumping of liquids at the microscale is a technology that is still to be optimized. The combination of an AC electric field with a small temperature gradient leads to a strong electrothermal flow that can be used for multiple purposes. Combining simulations and ... Per saperne di più
In the rapid development cycle of sensor systems, minimizing time-to-market is crucial. However, designing a new MEMS-chip (Micro-Electro-Mechanical Systems) presents significant challenges due to the extensive time required for manufacturing and characterization. This delay affects the ... Per saperne di più
Quasi-static 2D-MEMS vector scanners are micro-opto-electro-mechanical systems (MOEMS) made of monocrystalline silicon. The primary application for these controllable micromirrors is the high dynamic and precise deflection of laser beams, for example in light detection and ranging ... Per saperne di più
In order to facilitate semiconductor production in the upcoming technology nodes (3nm, 2nm, 14A) our state-of-the-art multi beam mask writer (MBMW) needs constant improvement in throughput and writing precision. As these two goals contradict each other, adaption of the electron optical ... Per saperne di più
The goal of this study is to exploit the phase change in vanadium dioxide (VO₂) for optical sensing. Infrared (IR) sensing is of paramount interest for next-generation Internet of Things (IoT) devices. Phase change materials (PCMs) are expected to enable low-energy consumption sensors, ... Per saperne di più
光纤拉锥技术是一种广泛应用的光纤后处理手段，通过对光纤形状和光学性能的调整，可以制造各种光纤器件，进而拓展光纤在传感、通信和非线性光学等领域的应用。拉锥过程中，需将光纤加热至二氧化硅的玻璃化转变温度以上，使其由玻璃态转变为粘流态，并通过在加热区施加拉力实现光纤的形变。有效控制该过程中的温度场和力学应力场对实现高精度光纤拉锥至关重要。 本研究利用COMSOL Multiphysics的多物理场耦合能力，构建了一个综合考虑固体传热、层流和动网格的光纤拉锥仿真模型。通过模拟光纤在高温区的受热过程及粘流态下的变形行为，该模型能够真实再现拉锥过程中热源 ... Per saperne di più
Resistive random access Memory (RRAM) is a non-volatile memory that operates by switching resistance between the formation (ON) and the rupture (OFF) of the conductive filaments (CF), representing the binary states of logic "0" and "1". RRAM is considered one of the most promising ... Per saperne di più
Photonic integrated circuits (PIC) play important roles in contemporary optical communication systems. Incorporating functional materials into PICs equips passive photonic devices with active modulation capabilities, unleashing great potentials in optical signal processing, quantum ... Per saperne di più
Wafer bonding technology has become a crucial process in 3D IC integration, particularly as a key method for monolithic integration where Through-Silicon Via (TSV) technology is not used [1]. However, due to the intricate mechanical stress and interconnect reliability issues associated ... Per saperne di più
超导转变边沿探测器（Transition edge sensor，TES）利用超导薄膜电阻对温度的高灵敏响应关系来精确测量光子能量。在TES探测器设计开发中，当前主要采用小信号原理，通过线性近似方式来建立探测器输出脉冲与各参数之间的关系，该方法无法分析探测器尺寸效应、信号饱和等情况，且无法处理更加复杂的结构，这限制了TES探测器技术的发展。 在本研究中利用COMSOL Mutiphysics®软件进行TES吸收体与超导薄膜传热分布，与电信号反馈的仿真。首先，利用COMSOL固体传热模块进行对TES器件进行传热物理场的建模。然后利用AC ... Per saperne di più