Introduction to Modeling Electrodeposition
Duration: 18:26
In electronics manufacturing, uneven electrodeposited coatings can result in poor performance and quality as well as excessive scrapping of material. The dedicated modeling capabilities of the Electrodeposition Module, an add-on to the COMSOL Multiphysics® simulation platform, help users understand and design electrodeposition processes that increase precision and minimize waste.
In this archived webinar, we discuss how the Electrodeposition Module can be used to create models for accurate predictions of the current density distribution and the coating thickness on electrodes with complex geometries. We also examine:
- Typical applications of the Electrodeposition Module
- How to create 3D and 2D models based on files imported with the ECAD Import Module
- How to use the software's specialized interfaces for primary, secondary, and tertiary current distribution
- Multiphysics modeling capabilities for fluid flow and heat transfer
The webinar concludes with a demo of modeling the electroplating of a PCB.
Suggested Resources
Chapter Selection
Modeling Capabilities (1:44)
Creating 3D and 2D Models with the ECAD Import Module (4:42)
The Primary and Secondary Current Distribution Interfaces (5:31)
The Tertiary Current Distribution Interfaces (6:59)
Deposit Thickness Calculation (8:50)
Fluid Flow and Heat Transfer (10:43)
DEMO: Electroplating of a Printed Circuit Board (11:40)