Copper Electroless Deposition
Application ID: 19863
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper.
In electroless deposition, partial oxidation and reduction reactions occur at the same electrode surface. The potential difference that exists between the equilibrium potentials for oxidation and reduction reactions and the potential at the electrode surface is the driving force for deposition process.
This tutorial predicts the change in current density, deposition thickness and concentration of ionic species during electroless deposition.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- either the Battery Design Module, Corrosion Module, Electrochemistry Module, Electrodeposition Module, or Fuel Cell & Electrolyzer Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Tabella delle Funzionalità and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.