Electrostatic Chuck
Application ID: 105311
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics (SM, ES, LF + HT) and moving mesh.
involves electrostatic force, fluid-structure interaction and heat transfer.
for now it is 2d Axisymmetric but can be adapted to a 3D model with more detailed gas channel patterns on e-chuck surface.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- either the AC/DC Module, or MEMS Module and
- either the MEMS Module, or Structural Mechanics Module and
- either the CFD Module, Microfluidics Module, or Plasma Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Tabella delle Funzionalità and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.