La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This tutorial model of the Joule heating effect in a busbar demonstrates how to synchronize an assembly between the PTC Creo Parametric™ software and the COMSOL Multiphysics® software, how to modify the geometry from COMSOL Multiphysics®, and how to run a ... Per saperne di più
Powder compaction is a popular manufacturing process not only in powder metallurgy, but also in the pharmaceutical industry. The Capped Drucker–Prager model is commonly used for simulating the compaction processes of pharmaceutical powders, where the material properties depend on the ... Per saperne di più
This tutorial model simulates a pair of straight conical bevel gears. The gears are modeled as rigid, but one of the gears is fixed while the other is hinged on a rigid bar. The rigid bar is also hinged at a point lying on the axis of the fixed gear. A transient analysis is performed to ... Per saperne di più
This tutorial model of the Joule heating effect in a busbar demonstrates how to synchronize an assembly between the Inventor® software and the COMSOL Multiphysics® software, how to modify the geometry from COMSOL Multiphysics®, and how to run a geometric parametric ... Per saperne di più
This tutorial simulates the turn-off transient (reverse recovery) of a simple PIN diode with an inductive load, loosely based on the book "Fundamentals of Power Semiconductor Devices" by B. J. Baliga (p. 256, 2008 edition). Unlike the book, which assumes an initial constant current ramp ... Per saperne di più
This model extracts spice parameters for a silicon p-n junction diode. The spice parameters are used to create a lumped-element equivalent circuit model of a half-wave rectifier that is compared to a full device level simulation. In this example, a device model is made by connecting a 2D ... Per saperne di più
This app demonstrates the following: Multiple components (1D and 3D) in a single app Using the same choice list in the app as in the model using Data Access functionality Output numerical results for a specific time step using a combo box The app combines the Ray Optics Module and ... Per saperne di più
This model demonstrates how to couple the Semiconductor interface to the Heat Transfer in Solids interface. A thermal analysis is performed on the existing bipolar transistor model in the case when the device is operated in the active-forward configuration. The Semiconductor interface ... Per saperne di più
Interfacial failure or delamination in a composite material can be simulated with a cohesive zone model (CZM). A key ingredient of a cohesive zone model is a traction-separation law that describes the softening in the cohesive zone near the delamination tip. This example shows the ... Per saperne di più
This tutorial drives a capacitively coupled plasma with an L-type matching network at high and low powers. At low power, where the harmonics in the current are low, prefect matching is obtained at the chosen power value. Sweeps over power, frequency, and pressure are performed and their ... Per saperne di più