La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Per saperne di più
This model extracts spice parameters for a silicon p-n junction diode. The spice parameters are used to create a lumped-element equivalent circuit model of a half-wave rectifier that is compared to a full device level simulation. In this example, a device model is made by connecting a 2D ... Per saperne di più
The model performs a static analysis on a piezoelectric actuator based on the movement of a cantilever beam, using the Piezoelectric Devices predefined multiphysics interface. Inspired by work done by V. Piefort and A. Benjeddou, it models a sandwich beam using the shear mode of the ... Per saperne di più
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Per saperne di più
A typical capacitor is composed of two conductive objects with a dielectric in between them. A voltage difference applied between these objects results in an electric field between them. This electric field exists not just directly between the conductive objects, but extends some ... Per saperne di più
This example demonstrates how an ESD event causes logic error of a microchip on a PCB board. The ESD current is based on the extended HBM (Human Body Model) and it is predefined in the Lumped Port feature. Per saperne di più
In this model, the effect of corrosion product on galvanic corrosion between a magnesium alloy (AE44) and mild steel in contact with brine solution is presented, wherein deformed boundaries due to both deposition of corrosion product as well as dissolution of magnesium are considered. ... Per saperne di più
Battery electrodes featuring large heterogeneities in terms of particle sizes may sometimes not be adequately described by homogenized models using one single particle size only. As an alternative to adding multiple instances of the Additional Porous Electrode material node, this ... Per saperne di più
This model calculates the DC characteristics of a simple MOSFET. The drain current versus gate voltage characteristics are first computed in order to determine the threshold voltage for the device. Then the drain current vs drain voltage characteristics are computed for several gate ... Per saperne di più
Power lines are commonly used as a means of transmitting electrical power across large distances. In this tutorial, towers transmitting high voltage three-phase AC power are modeled, and the resulting electric field is computed. The towers have two shielding lines. The model also ... Per saperne di più