COMSOL Multiphysics^® 6.3 Release Highlights

ECAD Import Module Updates

For users of the ECAD Import Module, COMSOL Multiphysics^® version 6.3 introduces several updates for importing PCB, integrated circuit (IC), and MEMS layouts. There is now support for importing component outlines from IPC-2581 and ODB++ files, enabling the creation of simplified geometries and plated vias with defined copper thickness. Additionally, designs can now be directly exported to the OASIS format. Explore these updates in detail below.

Import of Component Outlines for PCB Import

When importing IPC-2581 and ODB++ files into COMSOL Multiphysics^® version 6.3, simplified component geometries can be generated based on the component outlines in the files. Components can be represented as planar faces or extruded using height information from the file. These generated components are automatically assigned attributes for easy identification based on their names and package types. With the new Logical Expression Selection features, the attributes can be used in expressions to create selections.

The COMSOL Multiphysics UI showing the Model Builder with the Import node highlighted, the corresponding Settings window, and a PCB import model in the Graphics window.

Selecting the new Import component outlines option for this PCB model creates planar faces for the components that are to then be extruded. The ODB++ file is provided courtesy of Hypertherm, Inc., Hanover, NH, U.S.

Creating Plated Vias

The settings for importing IPC-2581 and ODB++ files now include a Plating thickness field, enabling the creation of domains for vias and plated holes with a specified copper plating thickness. Additional options provide control over whether to create core domains for different hole types, including vias, plated holes, and non-plated holes.

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Improved PCB Import for More Efficient Simulation Setup in 3D

The new default options for importing IPC-2581 and ODB++ files make it possible to create a 3D board geometry suitable for simulation in one step. The import process unites copper and dielectric regions, integrates vias and holes as domains or voids, and automatically generates selections for copper and dielectric regions for easy material and physics assignment. These improvements streamline the workflow, eliminating the need for manual Boolean operations and selection steps and preparing the geometry for swept meshing using the Form Assembly method. The Importing and Meshing a PCB Geometry from an ODB++ Archive tutorial model has been updated to showcase these improvements.

A 3D geometry of a PCB shown in green and brown.

Importing a PCB with the new default options results — in one step — in a 3D geometry that is suitable for simulation setup and swept meshing. The thickness of the layers is exaggerated in the image. The ODB++ file is provided courtesy of Hypertherm, Inc., Hanover, NH, U.S.

Export to OASIS Format

With COMSOL Multiphysics^® version 6.3, designs can now be exported directly to the OASIS format, a widely used standard for photomask design exchange. This new functionality streamlines workflows by removing the need for a separate translation step when sending prototypes to manufacturing. The export feature supports both 2D and 3D geometries. For 3D exports, users can select work planes to save as layers in an OASIS file.